![[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Effect of Different Material Systems on Interconnection Properties of 30μm Pitch Micro Bumps]()
[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Effect of Different Material Systems on Interconnection Properties of 30μm Pitch Micro BumpsDai, Fengwei; Zhang, David Wei; Zhang, Wenqi; Wang, Guojun; Yang, Dengfeng; Chen, Lin; Cao, Liqiang · 2018