Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies
- 期刊名称IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- 作者Kromann, G.B.
- 卷第18卷
- 期第1期
- 印刷ISSN1070-9886
- 文件大小615.31KB
- 发表时间1995-3
- DOI10.1109/95.370740
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[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologiesKromann, G.B. · 1994
[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - Investigation of heat sink attach methodologies and the effects on package structural integrity and interconnect reliability of the 119-lead plastic ball grid arrayEyman, L.M.; Kromann, G.B. · 1997
[IEEE Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Austin, TX, USA (5-7 March 1996)] Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessorsKromann, G.B. · 1996
[IEEE 1996 46th Electronic Components and Technology Conference - Orlando, FL, USA (28-31 May 1996)] 1996 Proceedings 46th Electronic Components and Technology Conference - The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessorsParry, J.; Rosten, H.; Kromann, G.B. · 1996
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[Back cover]IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1998
Call for papersIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1998