Challenging Inequality/Challenging Sociology
- 期刊名称Contemporary Sociology
- 作者Review by: S. M. Miller and Anthony J. Savoie
- 卷第28卷
- 期第1期
- 印刷ISSN0094-3061
- 电子ISSN1939-8638
- 文件大小172.90KB
- 发表时间1999-04
- DOI10.2307/2653847
- 页码30-34
Wafer level bonding using localized radio-frequency induction heatingMingXiang Chen; WenMing Liu; YanYan Xi; ChangYong Lin; Sheng Liu · 2010
[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Thermo-mechanical analysis of a wafer level packaging by induction heatingWenming Liu, ; Mingxiang Chen, ; Yanyan Xi, ; Changyong Lin, ; Sheng Liu, · 2008
[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Selective induction heating for wafer level bonding and packagingChen, Mingxiang; Liu, Wenming; Xi, Yanyan; Lin, Changyong; Wong, C. P.; Liu, Sheng · 2009