Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer
- 期刊名称IEEE Transactions on Advanced Packaging
- 作者Seungyoung Ahn, ; Junho Lee, ; Junwoo Lee, ; Jonghoon Kim, ; Woonghwan Ryu, ; Byung-Hun Kum, ; Hyun-Seok Choi, ; Chong K. Yoon, ; Joungho Kim,
- 卷第26卷
- 期第1期
- 印刷ISSN1521-3323
- 文件大小814.91KB
- 发表时间2003-02
- DOI10.1109/tadvp.2003.811554
- 页码90-98
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