Book reviews/critiques de livres
- 期刊名称Canadian Foreign Policy Journal
- 作者Dorn, A. Walter; Munton, Don
- 卷第11卷
- 期第3期
- 印刷ISSN1192-6422
- 电子ISSN2157-0817
- 文件大小123.79KB
- 发表时间2004-01
- DOI10.1080/11926422.2004.9673381
- 页码119-128
Copper-Core MCPCB With Thermal Vias for High-Power COB LED ModulesJuntunen, Eveliina; Tapaninen, Olli; Sitomaniemi, Aila; Jamsa, Markku; Heikkinen, Veli; Karppinen, Mikko; Karioja, Pentti · IEEE Transactions on Power Electronics · 2014
Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED ModulesJuntunen, Eveliina; Sitomaniemi, Aila; Tapaninen, Olli; Persons, Ryan; Challingsworth, Mark; Heikkinen, Veli · IEEE Transactions on Components, Packaging and Manufacturing Technology · 2012
Development of modular productsKusiak, A.; Chun-Che Huang, · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1996
Dynamic manufacturing process controlPearsall, K.; Raines, B. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
Electronic Components ObsolescenceCondra, L.W.; Anissipour, A.A.; Mayfield, D.D.; Pecht, M.G. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Nonvolatile MemoryBrewer, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Semiconductor workbench for integrated modelingWeckman, J. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
The benefits of stress testingChan, H.A. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1995
Metal diffusion in polymersDas, J.H.; Morris, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1994
Multiconductor transmission line characterizationWilliams, D.F. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1997