Quantum Well
- 期刊名称Physical Review Letters
- 作者Kondo, Y.; Ono, M.; Matsuzaka, S.; Morita, K.; Sanada, H.; Ohno, Y.; Ohno, H.
- 卷第101卷
- 期第20期
- 印刷ISSN0031-9007
- 电子ISSN1079-7114
- 文件大小698.15KB
- 发表时间2008-11-14
- DOI10.1103/physrevlett.101.207601
[IEEE 2006 International Conference on Applied Electronics - Pilsen, Czech Republic (2006.09.6-2006.09.7)] 2006 International Conference on Applied Electronics - Study of influences on the changes of the surface tensionDusek, Karel; Urbanek, Jan · 2006
[IEEE 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Eger, Hungary (2015.5.6-2015.5.10)] 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Determination of BGA solder joint detachment cause - warpage effectBusek, David; Dusek, Karel; Placek, Martin; Urbanek, Jan; Hornik, Jakub; Holec, Jan · 2015
[IEEE 2010 33rd International Spring Seminar on Electronics Technology (ISSE) - Warsaw, Poland (2010.05.12-2010.05.16)] 33rd International Spring Seminar on Electronics Technology, ISSE 2010 - Evaluation of tin whisker growthJiri, Podzemsky; Martin, Copjan; Jan, Urbanek; Karel, Dusek · 2010
[IEEE 2008 31st International Spring Seminar on Electronics Technology (ISSE) - Budapest, Hungary (2008.05.7-2008.05.11)] 2008 31st International Spring Seminar on Electronics Technology - Surface tension measurement of the solders by non-wetting specimenDusek, Karel; Urbanek, Jan · 2008
[IEEE 2007 30th International Spring Seminar on Electronics Technology - Cluj-Napoca, Romania (2007.5.9-2007.5.13)] 2007 30th International Spring Seminar on Electronics Technology (ISSE) - Wetting Force Measurement of the Different Types of Solders and Testing MaterialsDusek, Karel; Urbanek, Jan; Mach, Pavel; Drapala, Jaromir · 2007
[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Whiskers growth on thick tin layers and various types of surfacesPlacek, Martin; Dusek, Karel; Urbanek, Jan · 2014
[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Shear strength of joints made of lead-free soldersPodzemsky, Jiri; Urbanek, Jan; Dusek, Karel · 2011