[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Multi Physics Modelling of the Electrodeposition ProcessHughes, M.; Bailey, C.; McManus, K. · 2007

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - The needs of multi-scale/multi-physics simulation for RF Power packaging/product developmentYuan, Cadmus; Zhang, G.Q.; Salta, Joey; Jos, Rik · 2009

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Trends of Power Electronic Packaging and ModelingLiu, Yong; Irving, Scott; Luk, Timwah; Kinzer, Dan · 2008

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Modeling for defects impact on electrical performance of power packagesLiu, Yumin; Wu, Chung-Lin; Liu, Yong; Kinzer, Dan; Jeon, O S · 2010

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Modeling for critical design and performance of wafer level chip scale packageLiu, Yong; Qian, Qiuxiao; Ring, Matt; Kim, Jihwan; Kinzer, Dan · 2012