![[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Investigate the microstructure changes in Cu through-silicon vias (TSVs) under thermal process]()
[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Investigate the microstructure changes in Cu through-silicon vias (TSVs) under thermal processZhang, Zhaoqiang; Pang, Junwen; Wang, Jun; Song, Chongshen; Yu, Daquan · 2012