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Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking TechnologyTanida, Kazumasa; Umemoto, Mitsuo; Morifuji, Tadahiro; Kajiwara, Ryoichi; Ando, Tatsuya; Tomita, Yoshihiro; Tanaka, Naotaka; Takahashi, Kenji · Japanese Journal of Applied Physics · 2003