Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment
Ali, Bakhtiar; Sabri, Mohd Faizul Mohd; Said, Suhana Mohd; Sukiman, Nazatul Liana; Jauhari, Iswadi; Mahdavifard, Mohammad Hossein
- 期刊名称Microelectronics Reliability
- 作者Ali, Bakhtiar; Sabri, Mohd Faizul Mohd; Said, Suhana Mohd; Sukiman, Nazatul Liana; Jauhari, Iswadi; Mahdavifard, Mohammad Hossein
- 卷第82卷
- 印刷ISSN0026-2714
- 文件大小1140.64KB
- 发表时间2018-03
- DOI10.1016/j.microrel.2018.01.015
- 页码171-178