Effects of Dummy Thermal Vias on Interconnect Delay and Power Dissipation of Very Large Scale Integration Circuits
Xu, Peng; Pan, Zhongliang
- 期刊名称Wuhan University Journal of Natural Sciences
- 作者Xu, Peng; Pan, Zhongliang
- 卷第23卷
- 期第5期
- 印刷ISSN1007-1202
- 电子ISSN1993-4998
- 文件大小1143.01KB
- 发表时间2018-10
- DOI10.1007/s11859-018-1345-7
- 页码438-446