发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Effects of Dummy Thermal Vias on Interconnect Delay and Power Dissipation of Very Large Scale Integration Circuits

Effects of Dummy Thermal Vias on Interconnect Delay and Power Dissipation of Very Large Scale Integration Circuits

Xu, Peng; Pan, Zhongliang
  • 期刊名称Wuhan University Journal of Natural Sciences
  • 作者Xu, Peng; Pan, Zhongliang
  • 卷第23卷
  • 期第5期
  • 印刷ISSN1007-1202
  • 电子ISSN1993-4998
  • 文件大小1143.01KB
  • 发表时间2018-10
  • DOI10.1007/s11859-018-1345-7
  • 页码438-446
← 返回【学霸图书馆】主页