![[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Estimating the via-plane capacitance for differential vias with shared-antipad based on analytical equations]()
[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Estimating the via-plane capacitance for differential vias with shared-antipad based on analytical equationsZhang, Ying; Wang, Yansheng; Xu, Jun; Sui, Chunchun; Sen, Bidyut; Jin, Shuai; Fan, Jun · 2017