RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking
- 作者L. Cadix; C. Bermond; C. Fuchs; A. Farcy; P. Leduc; L. DiCioccio; M. Assous; M. Rousseau; F. Lorut; L.L. Chapelon; B. Flechet; N. Sillon; P. Ancey
- 卷第87卷
- 期第3期
- 印刷ISSN0167-9317
- 文件大小592.76KB
- 发表时间2010
- DOI10.1016/j.mee.2009.08.026
- 页码491-495
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