Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || TOWARDS EMBEDDED COOLING - GEN 3 THERMAL PACKAGING TECHNOLOGY
- 作者Iyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat
- 文件大小7956.79KB
- 发表时间2014
- DOI10.1142/9789814579797_0016
- 页码421-457
Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || BACK MATTERIyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat · 2014
Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || OPTIMIZATION UNDER UNCERTAINTY FOR ELECTRONICS COOLING DESIGNIyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat · 2014
Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || TOWARDS EMBEDDED COOLING - GEN 3 THERMAL PACKAGING TECHNOLOGYIyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat · 2014
Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || ENERGY REDUCTION AND PERFORMANCE MAXIMIZATION THROUGH IMPROVED COOLINGIyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat · 2014
Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || RECENT ADVANCE IN THERMOELECTRIC DEVICES FOR ELECTRONICS COOLINGIyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat · 2014
Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || SYNTHETIC JETS FOR HEAT TRANSFER AUGMENTATION IN MICROELECTRONICS SYSTEMSIyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat · 2014
Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || DYNAMIC THERMAL MANAGEMENT CONSIDERING ACCURATE TEMPERATURE-LEAKAGE INTERDEPENDENCYIyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat · 2014
Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || A REVIEW OF COOLING ROAD MAPS FOR 3D CHIP PACKAGESIyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat · 2014