[IEEE 2016 International Conference on Integrated Circuits and Microsystems (ICICM) - Chengdu, China (2016.11.23-2016.11.25)] 2016 International Conference on Integrated Circuits and Microsystems (ICICM) - A sub-1-ppm/°C curvature-compensated bandgap voltage referenceWan, Meilin; Gu, Haoshuang; Zhang, Zhenzhen · 2016

[IEEE 2016 IEEE International Conference on Electronics, Circuits and Systems (ICECS) - Monte Carlo, Monaco (2016.12.11-2016.12.14)] 2016 IEEE International Conference on Electronics, Circuits and Systems (ICECS) - A new compact wireless power transfer system using C-shaped printed resonatorsSharaf, Ramy; Hekal, Sherif; El-Hameed, Anwer Abd; Abdel-Rahman, Adel B.; Pokharel, Ramesh K. · 2016

[IEEE 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Hong Kong, Hong Kong (2016.8.3-2016.8.5)] 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - A 0.048ns/°C delay generator with variation self-calibration structure(VSCS) for HVICsLu, Yangyang; Wang, Yuming; Yu, Kuo; Miao, Long; Zhu, Jing; Sun, Weifeng · 2016

[IEEE 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Hong Kong, Hong Kong (2016.8.3-2016.8.5)] 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Solar-blind deep-ultraviolet photodetector based on the β-Ga<inf>2</inf>O<inf>3</inf> thin film grown on annealed c-plane sapphire substrateWu, Z. H.; Qian, L. X.; Sheng, T.; Zhang, Y. Y.; Liu, X. Z. · 2016

[IEEE 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Hong Kong, Hong Kong (2016.8.3-2016.8.5)] 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Implantation-free 2-step junction termination extension with 2-space modulated buffer trench regions for UHV 4H-SÍC GTO thyristorsZhou, Cai-Neng; Wang, Yan; Yue, Rui-Feng; Dai, Gang; Li, Jun-Tao · 2016

[IEEE 2016 IEEE International Solid-State Circuits Conference (ISSCC) - San Francisco, CA, USA (2016.1.31-2016.2.4)] 2016 IEEE International Solid-State Circuits Conference (ISSCC) - 16.3 A 16×16 pixels SPAD-based 128-Mb/s quantum random number generator with −74dB light rejection ratio and −6.7ppm/°C bias sensitivity on temperatureMassari, Nicola; Gasparini, Leonardo; Tomasi, Alessandro; Meneghetti, Alessio; Xu, Hesong; Perenzoni, Daniele; Morgari, Guglielmo; Stoppa, David · 2016

[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Effect of electroless Ni-P thickness on EFTECH 64-Ni, EFTECH 64-Cu and C194-Ni bumpOng, Cheng-Guan; Lau, Kok-Tee; Zaimi, Muhammad; Afiq, Muhammad; Queck, Kian-Pin · 2016

[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Nanomechanical properties and fracture behaviors of GaN and Al<inf>0.08</inf>Ga<inf>0.92</inf>N thin films deposited on c-plane sapphire by MOCVDYang, P.-F.; Huang, C.-C.; Chen, D.-L.; Lin, T.-C.; Tsai, Y.-H.; Jian, S.-R. · 2016

Performance Analysis of Micro Wind TurbineBased Energy Systems with SeriesConnected Invertersand a Novel Switching NetworkKumaran G, Kodeeswara; Parthiban, P. · Journal of Green Engineering · 2017