![[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Effect of electroless Ni-P thickness on EFTECH 64-Ni, EFTECH 64-Cu and C194-Ni bump]()
[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Effect of electroless Ni-P thickness on EFTECH 64-Ni, EFTECH 64-Cu and C194-Ni bumpOng, Cheng-Guan; Lau, Kok-Tee; Zaimi, Muhammad; Afiq, Muhammad; Queck, Kian-Pin · 2016