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[IEEE 2017 IEEE 5th Workshop on Wide-Bandgap Power Devices and Applications (WiPDA) - Albuquerque, NM (2017.10.30-2017.11.1)] 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors

[IEEE 2017 IEEE 5th Workshop on Wide-Bandgap Power Devices and Applications (WiPDA) - Albuquerque, NM (2017.10.30-2017.11.1)] 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors

Reynes, Hugo; Buttay, Cyril; Morel, Herve
  • 作者Reynes, Hugo; Buttay, Cyril; Morel, Herve
  • 文件大小879.60KB
  • 发表时间2017
  • DOI10.1109/wipda.2017.8170581
  • 页码404-410
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