A Thorough Training for Specialists in Agronomy
- 期刊名称Agronomy Journal
- 作者Lipman, Charles B.
- 卷第4卷
- 期第1期
- 电子ISSN0002-1962
- 文件大小96.14KB
- 发表时间1912
- DOI10.2134/agronj1912.00021962000400010012x
2-DOF vibratory gyroscope fabricated by SU-8 based UV-LIGA processJain, Ankush; Gopal, Ram · Microsystem Technologies · 2014
Reliability testing of Ni-Fe as structural material in MEMS gyroscopeJain, Ankush; Gopal, Ram · Journal of Micro/Nanolithography, MEMS, and MOEMS · 2016
Structural design of torsional micro-gyroscope having robust drive and sense modesJain, Ankush; Gopal, Ram · Microsystem Technologies · 2016
Modeling and fabrication studies of negative permeability metamaterial for use in waveguide applicationsPurushothaman, N.; Jain, Ankush; Taube, William R.; Gopal, Ram; Ghosh, S. K. · Microsystem Technologies · 2015
Fabrication of two-gimbal Ni–Fe torsional micro-gyroscope by SU-8 based UV-LIGA processJain, Ankush; Shekhar, Chandra; Gopal, Ram · Microsystem Technologies · 2015
AIP Conference Proceedings [American Institute of Physics 5TH NATIONAL CONFERENCE ON THERMOPHYSICAL PROPERTIES: (NCTP‐09) - Baroda (India) (7–9 October 2009)] - Electrostatic tuning of drive and sense modes in two-gimbal torsional gyroscopeJain, Ankush; Gopal, Ram · 2010
[IEEE 2013 26th International Conference on VLSI Design: concurrently with the 12th International Conference on Embedded Systems - Pune, India (2013.01.5-2013.01.10)] 2013 26th International Conference on VLSI Design and 2013 12th International Conference on Embedded Systems - Design and Simulation of Structurally Decoupled 4-DOF MEMS Vibratory GyroscopeJain, Ankush; Gopal, Ram · 2013
Optimization of MEMS capacitive accelerometerBenmessaoud, Mourad; Nasreddine, Mekkakia Maaza · Microsystem Technologies · 2013
Novel microstructured evaporation deviceWibel, Wolf; Maikowske, Stefan; Brandner, Juergen J. · Microsystem Technologies · 2015
HAMR HDD shock responsesHuang, Lidu; Suzuki, Kenzi; Huang, Fu-Ying; Hirano, Toshiki; Stipe, Barry · Microsystem Technologies · 2014
Tools for ultrasonic hot embossingLiao, S.; Gerhardy, C.; Sackmann, J.; Schomburg, W. K. · Microsystem Technologies · 2015
ForewordBharat Bhushan · Microsystem Technologies · 2014
Hybrid micro electrostatic actuatorHailu, Zewdu; He, Siyuan; Ben Mrad, Ridha · Microsystem Technologies · 2016
Special issue WaferBond’13Knechtel, Roy; Niklaus, Frank; Michel, Bernd · Microsystem Technologies · 2015
Editorial special issue HARMNST 2013Mohr, Jürgen; Göttert, Jost; Michel, Bernd · Microsystem Technologies · 2014