Product liability: A mechanical design for liability prevention : D. A. Guenther. J. Products Liability1, (4) 287 (1977)
- 卷第17卷
- 期第5期
- 印刷ISSN0026-2714
- 文件大小255.63KB
- 发表时间1978
- DOI10.1016/0026-2714(78)90898-3
- 页码485-486
Electronic System Thermal Design for ReliabilityHannemann, R. · 1977
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging Volume 44 || Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, ResultsSuhir, E.; Lee, Y. C.; Wong, C. P. · 2007
[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Study on high reliable design method for lead-free solder joints on electronic componentsTakagi, Kanji; Yu, Qiang; Shibutani, Tadahiro; Noro, Yukihiro · 2010
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Design and evaluation of polymer-carbon nanotube composites for reliable, low resistance, static and dynamic thermal interface materialsGreen, Craig E.; Prinzi, Leonardo; Cola, Baratunde A. · 2016
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Multi design variable optimization of QFN package on thick boards for enhanced board level reliabilityKrishnamurthy, Sumanth; Deshpande, Abhishek; Md Malekkul Islam, ; Agonafer, Dereje · 2016
[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability DesignHirohata, Kenji; Hisano, Katsumi; Kawakami, Takashi; Aoki, Hideo; Takubo, Chiaki; Takahashi, Kuniaki; Pecht, Michael G. · 2006
[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Thermal Shock Testing as a Reliability Qualification Test for Lead-Free SolderGoray, Kunal; Mahalingam, Saketh; Shah, Amit; Dasgupta, Abhijit · 2006