海量图书期刊资源,随时随地畅享阅读乐趣
Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloyYang, Li; Zhang, Yaocheng; Dai, Jun; Jing, Yanfeng; Ge, Jinguo; Zhang, Ning · Materials & Design · 2015
Interfacial microstructures and mechanical properties of Sn–9Zn–0.5Ga–xNd on Cu substrate with aging treatmentXue, Peng; Xue, Song-bai; Shen, Yi-fu; Zhu, Hong · Materials & Design · 2014
Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder JointsYang, Li; Ge, Jinguo; Zhang, Yaocheng; Dai, Jun; Liu, Haixiang; Xiang, Jicen · Journal of Electronic Materials · 2016
Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) Nanoparticles/Cu Low-Ag Solder JointsWu, Jie; Xue, Songbai; Wang, Jingwen; Xue, Peng · Journal of Electronic Materials · 2019
[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) jointsZeng, Jing-Bo; Xu, Guang-Sui; Zhou, Min-Bo; Zhang, Xin-Ping · 2012
[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al joints in assembling LED lighting componentsChen, Guo-Liang; Zhou, Min-Bo; Zhang, Lang; Lin, Yuan-Jiang; Zhang, Yu-Peng; Zhang, Xin-Ping · 2016